Business - Semiconductor International

· Displays Going Down, Solar Up at Applied

· Applied reports Q3 sales drop, reflects difficult semi industry environment

· Q2 silicon wafer shipments show modest rise, impacted by macroeconomic concerns, SEMI says

· Teradyne Talks Growth Initiatives, Pursues Entire ATE Market

· TSMC, UMC report July sales, weakened by lagging demand

· Is Anybody Out There?

· The Power of Pricing Management

· World’s top foundries to feel pinch of economic uncertainty in Q3

· Market for SOI to reach $1.1B by 2012, VLSI Research reports

· UMC Joins Sematech Research Consortium

Clean Processing - Semiconductor International

· Shin-Etsu Polymer Develops Lightweight Resin Frame for Thin Wafers

· Increasing Demands Require New Look at Wafer Cleans

· Resist Removal Walks a Tightrope

· Ulvac Intros High-Throughput Asher

· In Battle Against Haze, Rave Wields Rhazer

· iNEMI Issues Recommendations for Managing Lead-Free Solder Alloys

· Yield, Surface Prep for Nano Devices

· Novellus Offers Dry Strip Tools for High-Volume Memory, Advanced Logic

· Haze, Still Misunderstood, Costing Industry $1B a Year

· Applied Tackles Edge With Inflexion Polishing System

Lithography - Semiconductor International

· Researchers Apply Self-Assembly to NIL Master for Bit-Patterned Media

· Sematech EUV Resist at 22 nm Half-Pitch

· Sematech engineers advance EUV resist technology to 22-nm

· Carl Zeiss SMT to Acquire Israeli Start-Up Pixer Technology

· Chrome Going the Way of the Dodo Bird?

· Double Patterning Battles Cost, Complexity

· Self-Aligned Double Patterning Coming

· Lithography Picture Looks Pretty Grim for 22 nm

· In Battle Against Haze, Rave Wields Rhazer

· ASML’s Latest Immersion Tool Enables 38 nm Memory

Leading Edge - Semiconductor International

· 3D Integration Stays HOT at Semicon West

· Backside Illumination (BSI) Architecture next for CMOS Image Sensors

· Recent 3D IC Integration Activity

· Intel 45 nm Processor Technology for Mobile Products

· IITC on the 3D Integration Bandwagon

· More 3D Integration at ECTC 2008

· ASET drives 3D Integration workshop in Tokyo

· .......If it's Thursday it must be San Jose

· 3D Road Tour contd

· Road Trip Revelations

Wafer Processing - Semiconductor International

· IBM Alliance Builds 22 nm SRAM Cell

· Semtech plant impacted by fire, MEMC polysilicon operations impacted by storm

· Alchimer Claims 'Fully Wet' Via Solution

· Rohm and Haas expands Asia-Pacific manufacturing plant

· Roadmap Signals Showstoppers

· Memory Moves to Megafabs for NAND

· OEM Group Buys ‘Legends’ Tools From Applied

· When Will 450 mm Make Economic Sense?

· Novellus Debuts Deposition Tools During West

· Intermolecular Speeds R&D for Elpida’s Next-Gen Memory