Business - Semiconductor Online

· Fairchild Semiconductor Receives Assodel's "Best Semiconductor Vendor" Award

· Silicon Frontline Announces Success And Recognition; Post-Layout Verification Products Stand Out For Semiconductor Power Device, Nanometer And A/MS Design

· CSR And TSMC Collaboration Reaches New milestones

· SIAL) announced today it has teamed with 3M to distribute TIPS Pentacene, a high-performance soluble organic semiconductor for printed and flexible electronics">Sigma-Aldrich Teams With 3M To Provide TIPS Pentacene Organic Electronics Semiconductor For Growing Printed Electronics Industry

· Pinning Down Superconductivity To A Single Layer

· Hitachi High-Technologies To Acquire Semiconductor Manufacturing Equipment Business From Renesas

· ON Semiconductor Expands Power Management Offerings For Computing And Game Console Applications With New High-Density Trench MOSFETs

· Triad Semiconductor To Exhibit At International SoC Conference And Present On Via-Configurable, Mixed-Signal Embedded ASICs Using The ARM Cortex-M0 Microcontroller

· Semiconductor CMP Pad Technology Company NexPlanar Introduces New Element Line Of High-Performance Pads For Defectivity Reduction

· Transforming Nanowires Into Nano-Tools Using Cation Exchange Reactions

· Scientists Demonstrate Wafer-Scale Graphene-On-Silicon Technology

· GCT Semiconductor Develops World's Smallest Single-Chip T-DMB Mobile TV Receiver With Integrated DC/DC Converter

· Beceem Selects Mindspeed Broadband Gateway Processor For Use Within Its WiMAX VoIP Gateway Solution

· Diodes Incorporated To Present At TechAmerica AeA Classic 39th Annual Financial Conference

· NASA Selects Jazz Semiconductor And ADSANTEC For Lunar Atmosphere And Dust Environment Explorer (LADEE) Mission

· Axcelis Scores Another High Energy Win As Major Foundry Selects Optima XE For Advanced IC Manufacturing

· Silicon Brittle? Not This Kind!

· Researchers Create Single-Molecule Diode

· Cypress Introduces Industry's First 65-nm 144-Mbit SRAMs

· GEO Semiconductor To Present At The Houlihan Lokey Annual Technology Conference