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ECE 344 Equipment Instructions
for:
The Hot Point Probes
| Manufacturer |
Model |
Description |
Serial Number |
|
Home-made
|
|
Hot point probe
|
1
|
Related files:
INTRODUCTION
TO HOT POINT PROBES
A basic electrical property of semiconductor
materials is their type of conductivity, i.e., whether their majority carriers
are holes (p-type) or electrons (n-type). This property is very quickly
and simply determined by employing the hot point probe. It is also a quick
way of determining if all the oxide has been removed from a test area.
The free carriers in a semiconductor behave
in some ways as a gas of charged particles, a plasma. Just as heat makes
a gas expand (PV=nRT), the hot point makes carriers expand away from the
contact point. The charge of the dominant carrier species (electrons or
holes) determines the direction of the net current flow. A small component
of the net current may be due to the heat reducing the probability that
carriers remain confined spatially around their associated dopant atoms,
but room temperature is so high (above absolute zero) that virtually all
dopant atoms are already "excited." The extra excitation is negligible.
Carrier pair generation caused by the heating does not affect this measurement
since the current components from thermally generated electron-hole pairs
would cancel. Note that the measurement situation is a non-equilibrium
condition.
Operating
Instructions.
-
Turn on the power supply. This is starts heating
the tip.
-
Turn on the picoammeter. Make sure it's in
"Auto" scale mode.
-
Load your wafer.
-
Move the wafer chuck all the way toward the
front.
-
Place your wafer on the chuck. Be careful not
to hit the probe tips. As long as the test area is on the chuck, centering
is not important. Do not bother to slide the wafer beneath the tips, it
will only make it difficult to remove.
-
Probe the wafer.
-
Use the x-y stage to position the appropriate
test area beneath the probes. Plastic "spokes" on the chuck allow rotation
of the wafer. One is broken already.
-
Watch the probes closely as you use the green
button to lower them onto the wafer. Excessive "skating" can scratch the
wafer. Control of the probe descent is enhanced if you simultaneously apply
some pressure to the white button while the green button is pressed. Consult
your instructor if you suspect the prober needs adjustment. Please do not
re-adjust any of the knobs on the probe assembly unless you know how to
properly reset them.
-
Interpret the reading
-
Trace the wires to determine which direction
the picoammeter is connected into the circuit. Is its positive reference
input (center conductor if it uses a BNC connector) connected to the hot
or cold tip? Note the red and white dots on the holders for the probe tips.
These correspond to the similarly colored banana jacks.
-
Type determination. The picoammeter registers
a positive current when direct current flows into its positive reference
input. We leave it up to you to decide which sign on the picoammeter's
display corresponds to which conduction mechanism in the semiconductor.
A solid reading in the nanoamp range is sufficient. It may climb slowly
as the hot point heats up. No reading means either that the circuit is
open (possibly from dirty tips), the tip is not hot. Or that the material
is either insulating (oxide) or intrinsic (compensated). Consult your instructor
if you have reason to believe that prober has a problem. Usually, oxide
is the problem.
-
Remove the sample.
-
Use the white button to raise the tips.
-
Use the x-y stage to bring the wafer out from
under the tips.
-
Remove the wafer from the chuck. A drop of
water can make a wafer stick to flat surfaces with enough force that it's
possible to break the wafer by lifting it straight up. If the wafer resists
lifting, slide it off.
-
Turn off the picoammeter and power supply unless
someone else is going to use it next. Since the tips are so close, continuous
heating may warm up the "cold" point and reduce the sensitivity of the
apparatus, but the main reason for turning off the power supply is that
we don't have a spare heater. So don't skip this step!
Procedure
for the backup hot point probes
The diagram of the probe and its associated
circuits is given in Fig. D.l. Notice that on one of the probes a Variac
is provided as a heat control for the hot probe which is a small soldering
iron. The basic measuring circuit comprises a microammeter in series with
the two probes. The principle of measurement is discussed in the SEEC notes
(SEEC, Vol. 1, p. 197.).
-
Initially, set the Variac (if available) at
maximum to speed warm-up of the hot probe.
-
Place the wafer on a glass slide or glass plate.
-
For measurement set the Variac (if available)
near l00.
-
Touch both probes to the sample. The type of
majority carrier is indicated by the meter.
-
If the meter does not deflect, increase the
Variac setting (if available) to raise the temperature of the hot probe.
Increased sensitivity may be obtained also by using a sensitive external
current meter, such as the HP 425-A, connected to the jack and cable provided
for that purpose. It is sometimes necessary to remove a thin oxide coating
from the sample with HF.
Written by Dane Sievers - U of Illinois ECE
Dept. - dsievers@eceuil.ece.uiuc.edu with inspiration from Mike Fitzsimmons
E-mail comments and suggestions to ece344@uiuc.edu
or use the FEEDBACK
FORM.