Emergency


Home

A

B

C

D

E

F

G

H

I

J

K

L

M

N

O

P

Q

R

S

T

U

V

W

X

Y

Z

 ECE344: Index of the ECE344 Web Pages

It would be very helpful if you would send suggestions for entries you would like to see in this index. If you don't find an entry where you were looking, please use the FEEDBACK FORM.

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

A

Aluminum Evaporation
Annealing Contacts

B

BJTs (testing info)
Boron Drive
Boron Predep
Borosilicate Glass
Broken Wafer

C

Capacitors (testing info)
Contact Windows

Degreasing
DIFCAD
Diodes (testing info)

Electrical Testing
Ellipsometer (Section in IC fabrication experiment)
Ellipsometer (Instructions for use)
Emergency Procedures and Contacts

Engineering Worstations (EWS)

EWS Home Page

Running ICCAP on EWS

Equipment

Etching:

Borosilicate Glass

Aluminum

Oxide after PR1

Oxide after PR2

Oxide after PR3

Oxide after PR4

Phosphosilicate Glass

Exam (Final)

Fabrication Recipe
Facilities
Faculty and staff
FETs (testing info)
Final Exam
Final Report
Four Point Probe

Furnaces

Instructions

Temperature Setting form for diffusion furnaces

G

Gate Oxidation
Grader (on staff page)
Grades (Lab grades)

Hot Point Probe

ICCAP

Tutorial

Tutorial Commercial device plots

Tutorial Prelab

On EWS machines

LASI

Mask Set
Measurements (Electrical Device Testing)

Newsgroup uiuc.class.ece344

Oxidation:

Boron Drive

Furnaces

Gate Oxide

Initial

Prelab

Thickness Measurement

Oxygen Plasma

Phosphorous Predep
Phosphosilicate Glass

Photoresist

Photoresist Process

Photoresist Prelab

Plasma Asher

Prelabs

ICCAP Prelab

Oxidation Prelab

Photoresist Prelab

Probers: Operation
Process Overview BJT and FET cross-sections with description of ECE344 process.
Processes
Processing Report

RCA Clean
References

Reports

General Report Information

ICCAP Tutorial Report (Write-up)

Processing Report (for IC Wafer)

Safety
Schedule
Schottky Diode Fabricaiton
Software
Staff

Teaching Assistants (on staff page)
Temperature Setting form for diffusion furnaces
Testing (Devices on IC wafer)
Test Areas (in the center of the wafer)

What do students do in the lab?
When does the lab meet?
Where does the lab meet?
Why should students take this class?

Z