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ECE344: Theory and Fabrication of Integrated Circuits

Note: The lectures are not taken directly from Anner's book. The references indicate where the same or similar topic is covered in Anner: Planar Processing Primer.

Syllabus

1. Introduction
   • Class Organizaiton
   • Graduate Study
2. Processing Overview........................(Anner Chp. 1)
3. The Silicon Wafer..........................(Anner Chp. 2)
   • Wafer Manufacture...........(take a look at Mitsubishi Materials.)
   • Characterization...........................(Anner 3.1, 3.2, 3.4-3.9)
4. Oxidation...................................(Anner 5.4-5.7, 5.10)
   • Fick's Laws Derivation
   • Oxidation Chemistry
   • Grove's Model
5. Photolithography
   • Photochemistry of Resists
   • Photoimaging
6. Etching Processes
   • Wet Chemical Etching
   • Plasma Etching
   • Photoresist Removal
7. Junction Diffusion
   • Chemistry of Phases and Solid Solubility
   • Diffusion from a Constant Source
   • Junction Formation
   • Drive Diffusion and Time Dependent Diffusion
8. Bipolar Transistor Process Design
9. Diffusion Related Processes
   • Outdiffusion
   • Effective Masking
   • Dopant Sources and Process Control
   • Sheet Resistance of Diffused Layers
10. Metallization
    • Metal Semiconductor Band Diagram
    • Vacuum Metallization Systems
11. Chemical Vapor Deposition
    • Vapor Phase Chemistry and Reactors
    • Epitaxy
    • Deposited Insulators
12. Ion Beam Processing
    • Ion Optics
    • Ion Implantation
    • Implanted Profiles, Junctions, and Masking
    • Ion Beam Etching and Milling
13. pn Junction Electronics
    • Capacitance Profiling
    • Junction Breakdown
14. Device and Integrated Circuit Processing
    • MOS Capacitor
    • MOS Transistors
    • Bipolar Devices
    • Testing and Packaging
    • Yield and the Manufacturing Environment

Lecture/syllabus.html updated June 7, 1996

Warning! This is the archived 1999 Fabweb site! Here is the latest site