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17. PR5 (fifth photoresist sequence) and contact annealing:
Finally, a fifth mask is used to pattern the aluminum into appropriate shapes.
After annealing (baking) at 475 degrees Celcius to improve the aluminum
contacts with the silicon, the devices are ready to be tested.
Note: The diagrams in this overview have been somewhat simplified. The
various regions are not to scale, and any undercutting during etching, as well
as variations in the Si surface height due to silicon consumption during
oxidation have been ignored.
18. Device Testing: The devices are tested using microprobes connected to
test instruments which are controlled by an interactive computer program
which the students utilize to find optimized SPICE model parameters of the devices.
SPICE is a program often used in industry and in other courses to
simulate circuits. In ECE 344, the students get to see how the
models it uses can be determined.
This screen is maintained by
Kevin Beernink - U of Illinois ECE Dept. - beernink@uiuc.edu
E-mail comments and suggestions to ece344@uiuc.edu or use the
FEEDBACK FORM.
overview8.html
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