Level 3 Photoresist Removal

This step removes photoresist to prevent contamination of furnaces.

Equipment 

---

• Solvent waste container
• Microscope

Supplies

---

• Acetone
• IPA
• DI water

Operating parameters

---

three 15 second acetone rinses

-or-

min plasma ash

Equipment/controls/tools locations

---

Room 50J

• Solvent fume hood
• Microscope

Operating precautions

---

Chemical hazard

PR, acetone, and ipa are volatile and flammable. Keep away from flame. Possible biological hazards: only use in a fume hood.

Operating procedure

---

1. Initial PR Removal: Hold your wafer level over the waste acetone/IPA container (with the lid off) and squirt acetone on the wafer until it begins to flow off the edges. Let it dissolve the PR for 10-15 seconds before tossing the acetone into the waste container. Repeat until most of the PR is gone (~3 times).
2. Strip off any remaining PR residue by following the standard degreasing procedure (Acetone, IPA, DI, IPA, N2 dry.)
3. Inspect the wafer under a microscope for PR residue. Go back and degrease if necessary. Incomplete photoresist removal is the most common cause of furnace tube contamination. Please inspect wafers thoroughly.