Level 4 Photoresist Removal
Removal of photoresist prior to liftoff.
Equipment
- Solvent waste container
- Microscope
Supplies
Operating parameters
three 15 second acetone rinses
-or-
min plasma ash
Equipment/controls/tools locations
Room 50J
- Solvent fume hood
- Microscope
Operating precautions
Chemical hazard
PR, acetone, and ipa are volatile and flammable. Keep away from flame. Possible
biological hazards: only use in a fume hood.
Operating procedure
- Initial PR Removal: Hold your wafer level over the waste acetone/IPA container (with
the lid off) and squirt acetone on the wafer until it begins to flow off the edges.
Let it dissolve the PR for 10-15 seconds before tossing the acetone into the waste
container. Repeat until most of the PR is gone (~3 times).
- Strip off any remaining PR residue by following the standard degreasing procedure
(Acetone, IPA, DI, IPA, N2 dry.)
- Inspect the wafer under a microscope for PR residue. Go back and degrease
if necessary.
Incomplete photoresist removal is the most common cause of furnace tube contamination.
Please inspect wafers thoroughly.